00:00You've heard about the CXMT buzz, right?
00:02It sparked fears that China is catching up with Korea.
00:05How can Korean chipmakers break through?
00:08Let's look at the memory roadmaps Samsung and SK Hynix unveiled today.
00:12First, CXMT's technology.
00:14The key is a DRAM design called 4F².
00:17It packs memory cells more tightly to store more data in the same area,
00:21boosting production efficiency and cost competitiveness.
00:24Markets got nervous when China said it would release Server DRAM using it this year.
00:27But developing a technology and supplying products are two different things.
00:31An announcement doesn't show performance, defect-free volume, or real customers.
00:36Samsung has also been researching 4F² class DRAM.
00:39So this alone doesn't prove China has overtaken Korea.
00:42Still, China's chase can't be taken lightly.
00:45Real products could heat up competition in Server DRAM, a Korean stronghold.
00:50So how can Korean firms defend their edge?
00:53One key pillar is HBM, high bandwidth memory.
00:56Even if China makes conventional DRAM cheaper and more efficient,
01:00meeting customers' tough HBM specs at scale is hard to do in one leap.
01:05HBM demands stacking, heat management, yield, packaging, and customer qualification.
01:10Korean firms can lean on the know-how they've built here.
01:13But HBM isn't a cure-all.
01:15Leading in HBM doesn't end the threat in conventional DRAM.
01:19Korean firms must keep their lead in high-value HBM,
01:22while defending cost and performance in conventional DRAM.
01:25At today's Semiconductor exhibition, even more future-focused tech emerged.
01:30SK Hynix Development Chief, Ahn Hyun, outlined memory beyond HBM.
01:35Two stand out.
01:37HBF and three destacked DRAM.
01:40HBF uses NAN flash for high capacity and bandwidth.
01:43HBM excels at speed.
01:46HBF stands out for capacity.
01:48AI inference must store and retrieve lots of past conversation and task data,
01:53so high-capacity memory may grow in importance.
01:55But HBF won't replace HBM anytime soon.
01:59Standards, commercialization, performance, and pricing remain unproven.
02:02It's better seen as a way to expand memory's role in AI, not an HBM killer.
02:07Three destacked DRAM stacks memory directly with compute chips,
02:11shortening data paths and boosting efficiency.
02:12Samsung showcased a similar structure.
02:15Both are preparing for future AI chips beyond today's HBM race.
02:19Here's how the two stories connect.
02:21CXMT's 4F-squared aims to make conventional DRAM more competitive.
02:25Korea's HBM and Stacked Memory Target AI's need for speed and capacity.
02:30They solve different problems, so one announcement can't decide the winner.
02:34What should investors watch?
02:35First, whether CXMT ships real products this year,
02:39with confirmed performance, yield, and customers.
02:41Second, Samsung's and SK Hynix's HBM competitiveness.
02:46Supply volume, customer growth, and margins matter more than announcements.
02:49Rising costs or fiercer competition could cap profits even as demand grows.
02:54To wrap up, China's chase is a clear burden for Korean chip makers.
02:58But this announcement doesn't confirm a reversal.
03:00What matters isn't just how far China has come,
03:03but how well Korean firms turn their lead into profit and next-gen edge.
03:07Let's see.
03:07Inbwohl part 2
03:07Ancient
03:07How
03:07Phase
03:07Productions
